Inorganic adhesive composition
US5332432A · kind A · utility
28Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1993 |
| Grant date | Jul 26, 1994 |
| Priority date | — |
| Expiry date | Feb 16, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J1/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is an inorganic adhesive composition comprising (a) an aqueous silica sol and (b) an inorganic refractory powder along with one or more materials selected from (c) a fine powdery silica, (d) an aqueous alkali silicate solution and (e) a silane coupling agent. After hardening, the hardened product of the composition displays noticeably improved adhesion strength and electric insulating property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.