Screen printing apparatus for filling through-holes in circuit board with paste
US5332439A · kind A · utility
23Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1992 |
| Grant date | Jul 26, 1994 |
| Priority date | — |
| Expiry date | Aug 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a screen printing apparatus for filling minute through-holes in a board with conductive paste or the like by screen printing. When screen printing is performed with this screen printing apparatus, the board is placed on a stage through the intermediation of a film which is supplied to the stage by means of adhesive pads. The adhesive pads are brought into contact with the uppermost one of a plurality of stacked films to catch it by adhesion and then transfer the film to a position above the stage. Films are caught one after another by adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.