Application of fluidized material to a substrate using displacement transfer
US5332472A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1992 |
| Grant date | Jul 26, 1994 |
| Priority date | — |
| Expiry date | Nov 30, 2012 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD21H23/52
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This invention relates to the treatment of substrates with fluidized material in repetitive patterns during application cycles. The treatment patterns made with this invention can be altered by changing machine operating parameters. The patterns of fluidized material are applied to substrates using an applicator drum. Machined in the outer surface of the applicator drum are a plurality of slots filled with deformable material. The deformable material extends to a position in each slot just short of the outside diameter of the applicator drum, leaving a cavity in each slot. These cavities are filled with slurry in a slurry applicator unit. A compression drum mounted within the hollow interior of the applicator drum uses compression tips to displace the deformable material in each slot in succession beyond the periphery of applicator drum at a position adjacent to the substrate, causing the slurry in the cavity to be applied to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.