Method of fabricating a dielectric multilayer filter
US5332535A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1993 |
| Grant date | Jul 26, 1994 |
| Priority date | — |
| Expiry date | Apr 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A dielectric multilayer filter applicable to optical communication systems is disclosed, as is a fabrication method therefor, and an optical element incorporating the same. The disclosed dielectric multilayer filter includes a fluorinated polyimide base layer with a dielectric multilayer formed thereover. According to the disclosed fabrication method, a fluorinated polyimide layer is formed by applying liquid fluorinated polyimide material over a smooth surface to a predetermined thickness followed by drying and hardening, after which a dielectric multilayer is formed over the fluorinated polyimide layer by an ion assist vapor deposition method, and then stripping the fluorinated polyimide layer away from the underlying smooth surface. The disclosed dielectric multilayer filter can be easily and economically produced at a suitably small thickness with no need for grinding, exhibits highly uniform physical and optical properties, and is exceedingly durable and resistant to curling and warping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.