Electronic device sealing resin compositions and sealed electronic devices
US5332770A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1992 |
| Grant date | Jul 26, 1994 |
| Priority date | — |
| Expiry date | Aug 6, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed herein are electronic device sealing resin compositions containing (A) 40-25 parts by weight of a thermoplastic resin composed of 100-10 wt. % of a poly(arylene thioether-ketone) and 0-90 wt. % of a poly(arylene sulfide), (B) 60-75 parts by weight of an inorganic filler, and per 100 parts by weight of the sum of the thermoplastic resin (A) and inorganic filler (B), (C) 1.5-5 parts by weight of a silicone oil, (D) 10-15 parts by weight of a silicone rubber or (C) 0.5-3 parts by weight of a silicone oil and (D) 5-13 parts by weight of a silicone rubber. Electronic devices sealed using such resin compositions are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.