Unreinforced polyamide molding materials

US5332777A · kind A · utility

Assignee

• BASF SE

Inventors

• Walter Goetz · Ludwigshafen, DE
• Walter Betz · Ludwigshafen, DE

Key dates

• Filing date: Sep 25, 1992
• Grant date: Jul 26, 1994
• Expiry date: Sep 25, 2012

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/928
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Unreinforced polyamide molding materials contain PA1 A) from 60 to 100% by weight of a mixture consisting of PA2 A.sub.1) from 97.5 to 99.85% by weight of one or more polyamides, PA2 A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide and PA2 A.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atoms PA1 and, based on the total weight of the polyamide molding material, PA1 B) from 0 to 40% by weight of a toughened polymer and PA1 C) from 0 to 10% by weight of conventional additives in effective amounts.