Vapor reflow soldering apparatus
US5333774A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1993 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Mar 16, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vapor reflow soldering apparatus includes a unit for delivering an article processed to a vapor generating tank for generating saturated vapor of thermal medium, for allowing the article to be to come in contact with the saturated vapor, and for heating and melting solder of the article. A thermal medium recovery system collects thermal medium which flows in the article delivery path. There is also provided an arrangement for leading at least one part of exhaust gas containing mist from a recovery tank of the thermal medium recovery system for collecting and cooling thermal medium to the outlet-side delivery path for delivering the article. The exhaust gas with mist is blown off to the article being processed. The gas containing the mist is obtained by cooling the thermal medium in vapor phase state. The blown off gas containing mist to increases the cooling speed for the soldered part and the bonding strength, and reduces the consumption of thermal medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.