High density connector for stacked circuit boards
US5334029A · kind A · utility
85Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 1993 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | May 11, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/52
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.