Solder-bearing lead
US5334059A · kind A · utility
24Cited by
11References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 17, 1992 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Aug 17, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.