Soldering flux composition and solder paste composition
US5334261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 1993 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Jan 7, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Soldering flux and solder paste compositions which are non-acidic, low-residue, and non-corrosive, leaving no substantial residue after soldering without a subsequent cleaning process and yet exhibiting excellent solderability are disclosed. The compositions comprise (A) at least one compound which generates a peroxide by decomposition or oxidation when subjected to heating, and (B) at least one ester from an inorganic or organic acid which generates an acid by decomposition in the presence of compound (A). They are particularly advantageous for eliminating the cleaning process with a solvent such as Flon to solve the ozone layer destruction problem and for improving the performance of the in-circuit test for printed-circuit boards after soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.