Method for forming a pack cementation coating on a metal surface by a coating tape
US5334417A · kind A · utility
Inventors
Key dates
| Filing date | Nov 4, 1992 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Nov 4, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C10/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A pack cementation coating tape such as a nickel aluminide coating tape includes a reactive metal such as aluminum, a filler such as aluminum oxide, and a halogen carrier such as ammonium chloride held together by fibrillated polytetrafluoroethylene. The tape is useful in coating localized areas of nickel containing alloys to provide a nickel aluminide surface coating. The coating is formed by positioning the tape over the metal surface and heating the tape to a temperature of about 1250.degree. F. wherein the element metal such as aluminum reacts with the halogen carrier and in turn reacts with nickel on the surface of the nickel alloy to form the nickel aluminide coating. A masking tape formed from a separating layer, a brazing alloy layer and a nickel layer can be used to mask localized portions of the surface to prevent coating at these areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.