Thermoplatic molding materials

US5334658A · kind A · utility

Assignee

• BASF SE

Inventors

• Uwe Blumenstein · Ludwigshafen, DE
• Peter Klaerner · Battenberg, DE
• Horst Schuch · Heidelberg, DE
• Hans-Michael Walter · Freinsheim, DE

Key dates

• Filing date: Dec 16, 1992
• Grant date: Aug 2, 1994
• Expiry date: Dec 16, 2012

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L51/04
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A thermoplastic molding material contains, based on the sum of A and B, PA0 A: from 75 to 97% by weight of a polystyrene A as a hard matrix and PA0 B: from 3 to 25% by weight of a particulate, elastomeric (co)polymer B based essentially on butadiene or its copolymers, in turn consisting of, based on B, PA1 B1: from 40 to 98% by weight of a (co)polymer B1 having a mean particle size of from 100 to 600 nm and PA1 B2: from 2 to 60% by weight of a particle blend B2 which in turn consists of, based on B2, PA2 B21: from 1 to 60% by weight of a (co)polymer B21 having a particle size of from 200 to 1,200 nm and PA2 B22: from 40 to 99% by weight of a (co)polymer B22 having a mean particle size of from 1,200 to 8,000 nm, (co)polymer B1 having an encapsulated-particle morphology and (co)polymers B21 and B22 having a cellular and/or coiled particle morphology.