Semiconductor device and method of producing the same
US5334803A · kind A · utility
30Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1992 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Oct 28, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms part of a resin package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.