High density packaging for device requiring large numbers of unique signals utilizing orthogonal plugging and zero insertion force connetors
US5335146A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 29, 1992 |
| Grant date | Aug 2, 1994 |
| Priority date | — |
| Expiry date | Jan 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high density interconnection technique for connecting large numbers of unique signal lines between orthogonally positioned circuit cards, utilizes pins from the back of a zero insertion force connector (ZIF) to extend through the interconnection card and mate with a female socket connector on a second circuit board. Pins from the ZIF connector which are not aligned with the sockets of the orthogonally positioned socket connector may be connected to pins on the interconnection card which are aligned with the socket connector but not the ZIF. Very high numbers of connections between circuit cards may be made in a small volume and maintain signal line length at a minimum to ensure maximum signal transfer speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.