Polishing machine having a taut microabrasive strip and an improved wafer support head
US5335453A · kind A · utility
132Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Sep 27, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing machine having a taut microabrasive sheet. The machine includes a machine polishing disk in the form of a planar reference disk and a microabrasive sheet held taut on the disk by an appropriate mechanism. The mechanism for holding the microabrasive sheet taut can be a delivery roll and a receiving roll. The machine can be applied to the polishing of silicon wafers containing integrated components and in particular magnetic read-write heads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.