Manually operable die attach apparatus
US5336357A · kind A · utility
16Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Mar 12, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manually operable apparatus for selectively assembling chips to substrates comprises a support base having a first support for supporting a substrate preparatory to attachment of a chip thereto, second support for supporting a chip preparatory to selection for attachment to a substrate, a manually operable swing arm assembly mounted on the support base and having a first arm for placement of an adhesive paste to a surface of a substrate on the first support and a second arm for selecting and placing a chip on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.