Method for depositing conductive metal traces on diamond
US5336368A · kind A · utility
7Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Jul 8, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/38
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Adherent traces of a carbide-forming conductive metal are produced on a diamond surface, without deposition of carbide in areas to be non-conductive, by depositing an undercoat layer of a non-carbide-forming metal such as palladium, patterning said undercoat layer and then depositing a bond layer of the carbide-forming metal. The undercoat layer and the portion of the bond layer deposited thereon are then removed, typically by etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.