Patent · US Expired

Method of monitoring major constituents in plating baths

US5336380A · kind A · utility

11Cited by
1References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 1993
Grant dateAug 9, 1994
Priority date
Expiry dateMar 25, 2013

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N27/48
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of monitoring major constituents within a plating bath. The method involves applying an electrical signal to a working electrode positioned within the plating bath solution, varying signal parameters, and measuring the resultant response signal. The characteristics of the response signal indicate major constituent concentration levels. The method complements and is easily integrated with known voltammetric techniques for analysis of trace constituents, thus forming an integral part of an efficient overall plating bath analysis system. By adjusting major constituent concentration levels in accordance with measurements made using the method of the present invention, a high quality plating bath can be easily and inexpensively maintained.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.