Method of monitoring major constituents in plating baths
US5336380A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Mar 25, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/48
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of monitoring major constituents within a plating bath. The method involves applying an electrical signal to a working electrode positioned within the plating bath solution, varying signal parameters, and measuring the resultant response signal. The characteristics of the response signal indicate major constituent concentration levels. The method complements and is easily integrated with known voltammetric techniques for analysis of trace constituents, thus forming an integral part of an efficient overall plating bath analysis system. By adjusting major constituent concentration levels in accordance with measurements made using the method of the present invention, a high quality plating bath can be easily and inexpensively maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.