Method for coating circuitboards
US5336529A · kind A · utility
2Cited by
0References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 9, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Mar 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/04
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Bubble-free solder stop lacquer coatings of circuitboards are obtained for high conductor runs and close spacing, in that one proceeds from a photopolymerizable low-solvent lacquer, which is heated to pouring viscosity through a heatable roll and doctor blade by means of infrared lamps and is poured onto cooled circuitboards as a lacquer curtain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.