Sealing glass compositions
US5336644A · kind A · utility
43Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1993 |
| Grant date | Aug 9, 1994 |
| Priority date | — |
| Expiry date | Jul 9, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C8/24
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sealing glass composition suitable for bonding ceramic surfaces at low temperatures and which includes in weight percent 5-50% thallium oxide, 10-40% vanadium oxide, 5-30% tellurium oxide, 1.5-15% arsenic oxide and 1-5% phosphorous oxide. Other additives may be included, such as bismuth oxide. A paste formulated from said glass and a filler for the purpose of adjusting the fluidity and/or dielectric constant of the paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.