Process for fabricating electronic devices and image sensor
US5337474A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1992 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | May 29, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49789
Abstract
Input/output areas of device elements are provided at opposite ends of the original substrate, and two function areas are provided between the opposite input/output areas. The original substrate composing a large-size device is cut along lines in such a way that the input/output areas and the function areas are separated from one another. As a result, those portions of the original substrate where no function areas are to be formed are reduced, thereby contributing to effective utilization of the surface of the substrate for increasing the number of sensor substrates that can be yielded from it. The process is improved in the shape and layout of the substrates for electronic devices to be obtained by cutting the large-area device formed on the substrate and it hence is capable of yielding a greater number of electronic device elements from the large-area device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.