Embossing metal hold
US5338178A · kind A · utility
15Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1991 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Nov 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/81
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to the present invention, etching is used to form a concave and convex pattern corresponding to information on an embossing metal mold comprising a conductive layer and a layer which includes an Ni electric-plating layer, or an Ni electric-plating layer, so that the surface of the embossing metal mold will not be contaminated even if processing conditions are somewhat changed, and that the mold will have less defects. Thus, optical disk substrates of high quality can be produced. Besides, time required for manufacturing a stamper can be shortened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.