High density electronic connector and method of assembly
US5338208A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 1992 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Feb 4, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is disclosed a high density electronic connector assembly (system) having a first insulating portion and a second insulating portion adapted to be mated together and held in precise dimensional relation to each other with a suitable steady force. There are a plurality of contact members projecting down beneath the first portion on very close centers. There is a like plurality of socket holes in the second portion, with a respective printed-circuit (conductor) land at the bottom of each hole. Each land is adapted to act as a spring element to establish a minimum normal contact force. Seated in each hole is a small metal ball. Each ball is adapted to press against a respective contact member of the first portion when the upper and lower portions are fully mated. There is also disclosed a method of seating and re-flow soldering the balls to the respective lands in the socket holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.