Masks for applying dots on semiconductor wafers
US5338424A · kind A · utility
8Cited by
6References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1992 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Dec 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mask and an assembly utilizable in the production of a multiplicity of capacitors on selected regions of a semiconductor wafer includes a shaped, thin sheet of material having spaced-apart holes made therein and at least one recess formed adjacent each of at least two opposite edges thereof, the recess being configured to be engaged by a substantially matching portion of a clamp releasably affixing the mask onto the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.