Polyethylene molding composition

US5338589A · kind A · utility

Assignee

• Hoechst GmbH · DE

Inventors

• Ludwig Bohm · Mainz, DE
• Hans-Frieder Enderle · Frankfurt am Main, DE
• Horst Jarstrow · Kelkheim, DE

Key dates

• Filing date: Jun 3, 1992
• Grant date: Aug 16, 1994
• Expiry date: Jun 3, 2012

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/139
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A polyethylene molding composition which consists of 50 to 80% by weight of a HD polyethylene having a very broad bimodal molecular mass distribution and 20 to 50% by weight of a chemical LLD polyethylene or LD polyethylene gives pipes, plates and sheets which have very good long-term and low-temperature characteristics.