Conductive chip-type ceramic element and method of manufacture thereof
US5339068A · kind A · utility
68Cited by
5References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1993 |
| Grant date | Aug 16, 1994 |
| Priority date | — |
| Expiry date | Jun 18, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C1/142
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip-type ceramic element contains a terminal electrode at each end and an inorganic insulating layer on the surface of the ceramic element between the electrodes. The terminal electrodes include a baked electrode formed from a conductive paste reacted with the material of the inorganic insulating layer. Layers of nickel and tin are plated on the baked electrode for improved heat resistance and soldering adhesion, respectively. The insulating layer prevents unwanted portions of the terminal electrodes from coming into contact with the ceramic element, thereby preventing dispersion in the resistance values of the element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.