Adjustable height work holder for bonding semiconductor dies
US5340011A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 1992 |
| Grant date | Aug 23, 1994 |
| Priority date | — |
| Expiry date | Dec 9, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the die/package off of a carrier. The adjustable stop mechanism includes a first, stationary bracket having a leg extending towards a movable lifting member of the bonder, and a second bracket mounted to the movable lifting member. A set screw extending through the leg of the first bracket limits the upward movement of the movable member, and ensures that the front surface of a die being bonded is at an optimum position for bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.