Method and apparatus for the coating of substrates

US5340454A · kind A · utility

Assignee

• Leybold GmBH · DE

Inventors

• Christian Schaefer · Aspenhausiedlung, DE
• Klaus Hartig · Ronneburg, DE

Key dates

• Filing date: Jul 28, 1993
• Grant date: Aug 23, 1994
• Expiry date: Jul 28, 2013

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C14/568
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Method and apparatus for the coating of substrates (1, 1', . . . ), preferably by cathode sputtering in a vacuum apparatus consisting of at least one sputtering chamber (6) in which different coating systems can be applied to the preferably curved substrates to be coated (1, 1', . . . ), the substrates (1, 1', . . . ) can be moved in a direction B through the vacuum apparatus and pass through the sputtering chamber (6) repeatedly in direction B as well as in the opposite direction in the so-called multipass mode, the uncoated substrates (1, 1', . . . ) or substrate carriers (12, 11', . . . ) being combined before entering the sputtering chamber into groups of several, preferably two substrates (1, 1', . . . ) each, and these run simultaneously through the sputtering chamber (6) in the so-called dual multipass mode.