Microwaveable adhesive article and method of use
US5340649A · kind A · utility
26Cited by
18References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1992 |
| Grant date | Aug 23, 1994 |
| Priority date | — |
| Expiry date | Jul 2, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An adhesive article for use in a microwave oven is provided having a hot-melt or heat-curable adhesive substrate, and a susceptor layer of electrically conductive or semi-conductive microwave absorbing material that is disposed on at least a portion of the substrate. The article becomes less absorbent of microwave radiation upon the melting or deformation of the substrate. This article is suitable for adhering one adherend to another by exposing said article containing a hot-melt adhesive substrate to microwave energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.