Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives
US5340887A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1993 |
| Grant date | Aug 23, 1994 |
| Priority date | — |
| Expiry date | Jun 11, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/44
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A moisture-curable silicone hot-melt adhesive composition is disclosed, which composition comprises PA1 (i) a solid hydroxyl-functional organopolysiloxane resin comprising R.sub.3 SiO.sub.1/2 siloxane units and SiO.sub.4/2 siloxane units in a molar ratio of 0.5/1 to 1.2/1, wherein R is selected from hydrocarbon or halogenated hydrocarbon radicals; PA1 (ii) a diorganopolysiloxane polymer having silicon-bonded hydroxyl terminal groups and having a viscosity at 25.degree. C. of 100 to 500,000 centipoise, the weight ratio of said resin (i) to said polymer being (ii) in the range 40:60 to 75:25; PA1 (iii) a ketoximosilane, the amount of said ketoximosilane being sufficient to provide a molar ratio of X groups to total hydroxyl groups on said resin (i) and said diorganopolysiloxane (ii) of 0.9 to 3; and PA1 (iv) optionally, sufficient catalyst to accelerate the cure of said composition, said composition being an essentially solvent-free non-slump solid at room temperature, being extrudable at .ltoreq.150.degree. C. and forming an essentially tack-free elastomer when cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.