Patent · US Expired

Reactive hot-melt adhesive

US5342873A · kind A · utility

44Cited by

22References

5Claims

0Family size

Assignee

Sika AG, Vorm. Kaspar Winkler & Co. · CH

Inventors

Peter Merz · Hanerau-Hademarschen, DE
Lutz Zabel · Birmensdorf, CH
Christian Fischer · Waldbronn, DE

Key dates

Filing date	Nov 19, 1993
Grant date	Aug 30, 1994
Priority date	—
Expiry date	Nov 19, 2013

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2666/54
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A reactive, after cooling still viscous-plastic moldable hot-melt adhesive contains a mixture of PA1 at least one thermoplastic material, PA1 at least one binder on isocyanate basis, and PA1 at least one thixotropic agent, and the isocyanate content, referred to the total of the hot-melt adhesive, is in the range from 0.01 to 10 percent by weight.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.