Photosensitive resin composition
US5344744A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1992 |
| Grant date | Sep 6, 1994 |
| Priority date | — |
| Expiry date | Mar 9, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention imparts elasticity, reproducibility of dots, film toughness and wear resistance to printing plates obtained therefrom, in addition to good water developability and mechanical properties, by providing a photosensitive resin composition comprising: PA1 (A) 10 to 90% by weight of specific crosslinked polymer particles having a particle size of 0.01 to 5 micron, PA1 (B) 10 to 70% by weight of a specific hydrophobic elastomer, PA1 (C) 1 to 25% by weight of a hydophilic polymer having a molecular weight of 1,000 to 1,000,000, PA1 (D) 1 to 30% by weight of a basic nitrogen-containing compound, PA1 (E) 1 to 60% by weight of a photopolymerizable ethylenically unsaturated monomer, and PA1 (F) 0.01 to 10% by weight of a photopolymerization initiator; % by weight being based on a total amount of the resin composition. The present invention also provides a flexoprinting plate obtained from the above resin composition and a process for producing the flexoprinting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.