Thermoplastic molding material
US5344869A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1992 |
| Grant date | Sep 6, 1994 |
| Priority date | — |
| Expiry date | Nov 25, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/94
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding materials contain, based in each case on the sum of components A, B and C, PA1 A: from 10 to 90% by weight of a polymer A composed of styrene and/or substituted styrene, PA1 B: from 10 to 90% by weight of a polyolefin B and PA1 C: from 5 to 40% by weight of a star block copolymer C containing not less than 50% by weight of styrene and prepared by anionic polymerization of styrene and butadiene and/or isoprene, coupling and subsequent selective hydrogenation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.