Molding compounds having improved fire behavior
US5344876A · kind A · utility
3Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1992 |
| Grant date | Sep 6, 1994 |
| Priority date | — |
| Expiry date | Dec 29, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L27/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Molding compounds of acrylate polymers, optionally graft rubbers and/or optionally resin-like vinyl polymers containing 0.05 to 5% by weight tetrafluoroethylene polymers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.