Method of manufacturing IC card
US5346576A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1993 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Jul 2, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the card substrate and the IC module is filled. Furthermore, the gap from the IC module is narrower at the corners of the IC module than conventionally shaped openings. As a result, gaps at the corners of the IC module after integral molding are prevented. Therefore, the gap between the IC module and the card substrate can be reliably filled during molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.