Article comprising solder with improved mechanical properties
US5346775A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1993 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Feb 22, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12486
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.