Semiconductor non-corrosive metal overcoat
US5346858A · kind A · utility
23Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1992 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Jul 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is a method of preventing active metal circuit corrosion on a semiconductor device. Non-corrosive multi-layers of metals are applied over the entire surface of a semiconductor, and then the multi-layers are etched to separate the portions on device contacts from the portions on the non-contact areas of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.