Water curable resin compositions
US5346939A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1993 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Jan 25, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D5/34
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a water-curable resin composition for use in the preparation of composite materials. The resin composition is composed of a water-reactive liquid organometallic compound having a viscosity of no greater than about 500,000 centipoise under ambient conditions; and a nonreactive organic thermoplastic polymer, having a number average molecular weight of at least about 1,000, mixed with the water-reactive liquid organometallic compound. Preferably, the water-reactive liquid organometallic compound is a compound of the formula (R.sup.1 O).sub.x MR.sup.2.sub.(y-x) wherein: each R.sup.1 is independently a substituted or unsubstituted C.sub.1 -C.sub.100 hydrocarbon group, optionally interrupted in the backbone by 1--10 nonperoxide--O--, --S--, --C(O)--, or --N-- groups; each R.sup.2 is independently selected from the group consisting of hydrogen and a substituted or unsubstituted C.sub.1 -C.sub.100 hydrocarbon group, optionally interrupted in the backbone by 1--10 nonperoxide--O--, --S--, --C(O)--, or --N-- groups; x is an integer between 1 and y, inclusive; y is the valence of M; and M is boron, aluminum, silicon, or titanium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.