Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US5347428A · kind A · utility
335Cited by
3References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1992 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Dec 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.