Method for manufacturing a multilayer wiring board
US5347712A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1993 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | Jun 14, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring board and a method for manufacturing the same are disclosed. The wiring board comprises an insulating substrate having a first and second conductor layers formed on major surfaces of the insulating substrate, a blind hole formed through the first conductor layer and the insulating substrate to expose the second conductor layer at the bottom of the blind hole, and a connecting conductor provided to cover the exposed surface of the second conductor layer wall portion of the blind hole and the first conductor layer. Since the connecting conductor and the second conductor are made in surface contact, connection reliability is very much improved. The blind hole is made by blasting a fine abrasive powder beam to selectively remove the insulating substrate. The end of selective removal can be easily controlled by the difference of working speed against the insulating substrate and the conductor layer to successfully expose the second conductor layer at the bottom of the blind hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.