Method of mounting semiconductor elements
US5348214A · kind A · utility
11Cited by
15References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1993 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | Feb 2, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a plurality of semiconductor elements each having bump electrodes on a wiring board by pressing the semiconductor elements to the wiring board while aligning the electrodes and heating the structure. In the mounting method, one or more heat sinks are previously joined to the backs opposite to the surfaces with the bump electrodes formed thereon of the semiconductor elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.