High density integrated backplane assembly
US5348482A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1993 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | Jun 11, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1412
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A backplane assembly (200) for a compact card cage such as a junction box (10) having a forward wall section (202) and a rearward wall section (14) with interconnection circuitry (206) disposed therebetween. Struts (216) join forward and rearward wall sections and the backplane assembly is manipulatable as a unit. Interconnection circuitry (206) can be a laminar assembly of flexible circuit elements (230) with terminals (220) of daughter card-matable connectors (204) of the forward wall terminated to circuits thereof at a first connection region CR.sub.1 and terminals (212)of input/output connectors (208) terminated at a second connection region CR.sub.2. All circuits from second region CR.sub.2 can be directed to an integration region CR.sub.M part of first region CR.sub.1 and selected circuits can be directed to terminals of daughter card-matable connectors elsewhere in first region CR.sub.1 connected by a programmable integration member (130).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.