Die paste transfer system and method
US5348611A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1992 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | May 20, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A die paste transfer system wherein a first layer of bonding paste is transfer to a surface of the die as the die moves through the paste station in a controlled manner. The control for the transport controls orientation which the die passes through the paste station and the orientation of the die at the bonding site. The height of the die is varied as it passes through a second layer of paste. The speed at which the die and the second layer of bonding paste move well to each other is also adjusted to produce the desired thickness of the first layer on the die. Shear is produced in the second layer to affect transfer of the bonding paste from the reservoir to the die. For larger dies, the die may enter and leave the paste more than once to produce individual plateaus spaced from the edge of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.