Multilayered wiring board with wiring configurations to reduce crosstalk
US5348792A · kind A · utility
11Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1993 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | Apr 19, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This multilayered wiring board having a multilayered wiring structure includes a first mesh wiring layer having a plurality of holes therein, and a second wiring layer having a plurality of wirings. The wirings of the second wiring layer undulate up and down so as to descend towards the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding toward the second wiring layer at locations between adjacent ones of the wirings of the second wiring layer. In these wiring boards, crosstalk between the wirings is suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.