Package and method for assembly of infra-red imaging devices
US5349234A · kind A · utility
12Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 1992 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | May 29, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/4824
Abstract
Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal expansion between the chip and its package as they are cycled over a temperature range are disclosed. An adhesive tape covers an active area of the chip and leaving bonding pads on the chip exposed through a recess in the adhesive tape. A body with a similar recess supports the other side of the tape. Wire bonds are made in the recess to connect bonding pads on the body to the chip. A lid covers the recess to protect the wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.