Integral extended surface cooling of power modules
US5349498A · kind A · utility
55Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1992 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | Dec 23, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor wafer of the power module is mounted directly, separated only by thermal expansion control layers and insulator layers, on the metal base which has fins or pins integrally formed thereon. This module is mounted on a coolant fluid flow chamber so that the module mounting is not a thermal interface. In this way, maximum power module cooling is achieved with minimum fluid flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.