Stackable interconnection socket
US5350306A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1992 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | Dec 23, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53283
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly (100) aligns for mating and interconnecting at least two integrated circuit packages (102a, 102b) having a plurality of leads extending from the packages. A protective shroud (101) covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board. Resilient latches (534) on the protective shroud deflect to engage bumpers (210) on the second package to maintain the assembly on the circuit board. An extraction tool facilitates disengagement of the assembly from the second package mounted on the printed circuit boa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.