System of electronic laminates with improved registration properties
US5350621A · kind A · utility
31Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1992 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | Nov 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.