Epoxy resin and adhesive composition containing the same
US5350811A · kind A · utility
22Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1993 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | Jun 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.