Copper bonding epoxy resin compositions, resin coated copper articles and method
US5350815A · kind A · utility
6Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1993 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | May 21, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A bare copper conductor is provided with a tenaciously adhering epoxy resin by heating and curing in situ on the conductor a coating of a solution of cycloaliphatic epoxy resin, a hardener, stannous octoate as a catalyst, and a phenolic accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.